Navigationsweiche Anfang

Navigationsweiche Ende

Sprache wählen

Kontakt

Arbeitsgruppe Angewandte Mathematik / Numerische Analysis
Bergische Universität Wuppertal
Fakultät 04
Gaußstraße 20
D-42119 Wuppertal
Deutschland

Telefon: +49 202 439 5296
Fax: +49 202 439 5201
E-Mail: sek-amna{at}math.uni-wuppertal.de

Aktuelles

Keine Nachrichten verfügbar.

Thermal Coupling

The performance of high-tech circuitry such as processors and power devices also largely depends on the thermal level. Semiconductor devices loss their ability of fast switching if the temperature increases to much. Furthermore after a critical temperature is reached the device will be destroyed. Therefore monitoring temperature and regulating cooling are important issues.

In our research, we set up simulation models for semiconductor equations and integrated circuits, which incorporate transient temperature changes in the device and heat conduction between devices. That is an electric network as well as semiconductor equations have to be equipped with an appropriate model for power transfer and heat conduction.

Since this multiphysical problem of coupled electric networks and heat conduction exhibits widely separated time scales, not only the model but also the numerical algorithms need be design to enable fast simulations. Multirate cosimulation is an good choice if the coupling is appropriately set up. Please see also: (Coupled DAEs).

Publications

Referenzen
15.
J. Kühn; A. Bartel; P. Putek
A Thermal Extension of Tellinen's Scalar Hysteresis Model
Scientific Computing in Electrical Engineering SCEE 2018 Band X aus Mathematics in Industry
Herausgeber: Springer, Berlin,
2019
14.
P. Putek; P. Meuris; M. Günther; J. ter Maten; R. Pulch; A. Wieers; W. Schoenmaker
Uncertainty Quantification in Electro-Thermal Coupled Problems based on a Power Transistor Device
IFAC-PapersOnLine, 48(1):938--939
2015
13.
P. Putek; P. Meuris; M. Günther; E. J. W. ter Maten; R. Pulch; A. Wieers; W. Schoenmaker
Uncertainty quantification in electro-thermal coupled problems based on a power transistor device
IFAC-PapersOnLine, 48(1):938--939
2015
12.
T. Bechtold; D. Hohlfeld; E. B. Rudnyi; M. Günther
Efficient extraction of thin film thermal parameters from numerical models via parametric model order reduction
J. Micromech. Microeng., 20
2010
ISSN: 045030
11.
G. Ali; A. Bartel; M. Culpo; C. De Falco
Analysis of a PDE thermal element model for electrothermal Circuit Simulation
Roos, J. and Costa, L. R. J., Autoren, Scientific Computing in Electrical Engineering (SCEE 2008) , Seite 273--280.
Herausgeber: Springer,
2010
10.
A. Bartel; U. Feldmann
Modeling and Simulation for Thermal-Electric Coupling in an SOI-Circuit
Anile, A. M. and Alì, G. and Mascali, G., Autoren, Scientific Computing in Electrical Engineering (SCEE-2004 Proceedings) , Seite 27--32.
Herausgeber: Springer,
2006
9.
A. Bartel; M. Günther
Multirate Co-Simulation of First Order Thermal Models in Electric Circuit Design
Schilders, W. H. A. and et al., Autoren, Scientific Computing in Electrical Engineering. Proceedings of the SCEE-2002 Conference held in Eindhoven
Seite 104--111.
Herausgeber: Springer-Verlag, Berlin,
2004
8.
A.: Bartel
Partial Differential-Algebraic Models in Chip-Design --- Thermal and Semiconductor Problems
TU Munich, Fortschritt-Berichte, VDI Verlag, Düsseldorf,
2004
7.
A. Bartel; M. Günther
From SOI to abstract electric-thermal-1D mutiscale modeling for first order thermal effects
Mathematical and Computer Modelling of Dynamical Systems, 9:25--44
2003
6.
A. Bartel; M. Günther; M. Schulz
Modeling and Discretization of a Thermal-Electric Test Circuit
Antreich, K. et al, Autoren, Modeling, Simulation and Optimization of Integrated Circuits
Seite 187--201.
Herausgeber: Birkhäuser Verlag, Basel,
2003
5.
A.: Bartel
First order thermal PDAE models in electric circuit design
Troch, I. and Breitenecker, F., Autoren, Proceedings 4th Mathmod, Vienna 2003
2003
4.
E. J. W. ter Maten; A. J. M. Huijben
Vector extrapolation applied to a time cyclic heat problem
Lewis, R. W., Autoren, Numerical methods in thermal problems Band 8(2) , Seite 983-994.
Herausgeber: Pineridge Press Lmt, Swansea, UK,
1993
Seite:  
Zurück | 1, 2 | Weiter
Export als:
BibTeX, XML