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Thermal Coupling

The performance of high-tech circuitry such as processors and power devices also largely depends on the thermal level. Semiconductor devices loss their ability of fast switching if the temperature increases to much. Furthermore after a critical temperature is reached the device will be destroyed. Therefore monitoring temperature and regulating cooling are important issues.

In our research, we set up simulation models for semiconductor equations and integrated circuits, which incorporate transient temperature changes in the device and heat conduction between devices. That is an electric network as well as semiconductor equations have to be equipped with an appropriate model for power transfer and heat conduction.

Since this multiphysical problem of coupled electric networks and heat conduction exhibits widely separated time scales, not only the model but also the numerical algorithms need be design to enable fast simulations. Multirate cosimulation is an good choice if the coupling is appropriately set up. Please see also: (Coupled DAEs).

Publications

Referenzen
9.
Markus Brunk; Ansgar Jüngel
Simulation of thermal effects in optoelectronic devices using coupled energy-transport and circuit models
Mathematical Models and Methods in Applied Sciences (M3AS), 18:2125 - 2150
2008
8.
Markus Brunk; Ansgar Jüngel
Numerical simulation of thermal effects in coupled optoelectronic device- circuit systems
In Jäger, W. and Krebs, H. J., Editor,
Seite 29 - 38.
Herausgeber: Springer, Berlin
2008
7.
Markus Brunk
Numerical simulation of thermal effects in electric circuits via energy-transport equations
Proceedings in Applied Mathematics and Mechanics (PAMM), 6(1):47 - 50
2006
6.
Andreas Bartel; Uwe Feldmann
Modeling and simulation for thermal-electric coupling in an SOI-circuit
In Anile, A. M. and Ali, Guiseppe and Mascali, Giovanni, Editor, Scientific Computing in Electrical Engineering. Mathematics in Industry , Seite 27 -- 32.
Herausgeber: Springer, Berlin
2006
5.
Andreas Bartel
Partial Differential-Algebraic Models in Chip Design - Thermal and Semiconductor Problems. Fortschritt-Berichte VDI
aus 20
Herausgeber: VDI-Verlag, Düsseldorf
2004
4.
Andreas Bartel; Michael Günther
Multirate co-simulation of first order thermal models in electric circuit design
In Schilders, W. H. A. and ter Maten, E. Jan W. and Houben, S. H. M. J., Editor, Scientific Computing in Electrical Engineering. Mathematics in Industry , Seite 104 -- 111.
Herausgeber: Springer, Berlin
2004
3.
Andreas Bartel; Michael Günther
From {SOI} to abstract electric-thermal-1D multiscale modeling for first order thermal effects
Mathematical and Computer Modelling of Dynamical Systems, 9(1):25 -- 44
2003
2.
Andreas Bartel; Michael Günther; Martin Schulz
Modeling and discretization of a thermal-electric test circuit
In Antreich, K. and Bulirsch, R. and Gilg, A. and Rentrop, Peter, Editor, Modeling, Simulation and Optimization of Integrated Circuits. International Series of Numerical Mathematics aus 146 , Seite 187 -- 201.
Herausgeber: Birkhäuser,
2003
1.
Andreas Bartel
First order thermal PDAE models in electric circuit design
In Troch, I. and Breitenecker, F., Editor, Proceedings 4th Mathmod , Seite 1376 -- 1381.
Vienna
2003
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